News Releases

BASF is now expanding its polyphthalamide (PPA) portfolio by a new Ultramid^® Advanced N grade that is especially suited for connectors post-processed with surface mount technology (SMT). Ultramid^® Advanced N2U40G7 shows the ideal balance of high flowability, toughness and flame retardancy. It thus enables miniaturization with thin-wall structures at high power and data throughput in electronic applications such as computers, laptops, servers, smart phones as well as smart household appliances and wearable devices.