In the electrical and electronics (E&E) industry, the trend for further miniaturization drives the development of the next generation of high-performance parts, especially in the connector market. The challenges for these parts so far made of standard materials now lie in combining dielectric with mechanical strength, and this in very demanding conditions and on a performance level that standard plastics have not been able to reach so far. Furthermore, good mechanical properties at high temperatures and resistance to humid environments or chemicals call for new plastic materials as an alternative for metal to save weight.
In order to connect these needs with an appropriate solution, BASF is now extending its polyphthalamide (PPA) portfolio with Ultramid® Advanced T2000 – a new compound group based on the polyphthalamide 6T/66. Ultramid® Advanced T2000 combines excellent mechanical with dielectric strength at high temperatures – a combination which is particularly needed for electrical and electronic connectors. Due to its partially aromatic chemical structure, Ultramid® Advanced T2000 is a versatile alternative to metal in specific humid conditions.
